Product introduction: This product presents a crystalline form close to a cubo-octahedral, with low impurity content and high particle concentration. It offers high stability and a high thermal conductivity coefficient. Size Available: 35um-1300um Application: Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad and etc. Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.

Product introduction: This product presents a regular cubo-octahedral crystalline form, with extremely low impurity content. It possesses a very high thermal conductivity coefficient, particle concentration, and product stability. Size Available: 40um-1300um Application: Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc. Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad and etc.