Product introduction:
This product presents a crystalline form close to a cubo-octahedral, with low impurity content and high particle concentration. It offers high stability and a high thermal conductivity coefficient.
Size Available: 35um-1300um
Application:
- Thermal Interface Materials(TIM): Thermal gap fillers, Thermal grease and gel, Thermal adhesives, Thermal pad and etc.
- Diamond Metal Matrix Composites(DMMC): Cu-Diamond MMC, Al-Diamond MMC and etc.
